Productstructure: FR-4+TG170+Panasonic PI, four layers of soft shadow combination, minimum hole 0.15mm, plate thickness 1.60mm, nickel palladium gold 3U",
Our Services
We are a Manufacturer & Supplier Specializing in Double Side PCB, Multi-Layer PCB, F4BK PCB, Ceramic PCB, Rogers PCB, Aluminum PCB. Meanwhile, we provide PCBA ( Assembly) and ODM, OEM service. We are specializes in a full SMT and through hole PCBA assembly, obtaining components, building prototype quantities, and testing. High quality,good price and service.
- Delivery time:5-7days.
- Certificates:UL,ISO9001,RoHS
Our capability
- Our professional engineering team can put your project into production in a short time. Sample pictures and BOM are needed to make customized products
- We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured according to customers' requests or samples. Plastic injection processing available.
- We have advanced equipment for through-hole and SMT DIP COB cable assembly.
- ROHS compliant and lead-free process.
- In-circuit, functional tests& burn-in tests, full system test
- High output to guarantee prompt delivery.
PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products
Detailed Specification of Flexible PCB Manufacturing
| Technical Specification |
| Layers: | 4~30 Layers(flex Pcb) and 4~80 (rigid flex) | |
| Min Panel Size: | 5mm x 8mm | |
| Max Panel Size: | 250 x 520mm | |
| Min Finished board thickness: | 0.05mm (1 sided inclusive copper) | |
| Max Finished board thickness: | 0.3mm (2 sided inclusive copper) | |
| Finished board thickness tolerance: | ±0.02~0.03mm | |
| Material: | Kapton, Polyimide, PET | |
| Base copper thickness (RA or ED): | 1/3 oz, 1/2 oz, 1oz, 2oz | |
| Base PI thickness: | 0.5mil, 0.7mil, 0.8mil, 1mil, 2mil | |
| Stiffner: | Polyimide, PET, FR4, SUS | |
| Min Finished hole diameter: | Φ 0.15mm | |
| Max Finished hole diameter: | Φ 6.30mm | |
| Finished hole diameter tolerance (PTH): | ±2 mil ( ±0.050mm) | |
| Finished hole diameter tolerance (NPTH): | ±1 mil ( ±0.025mm) | |
| Min width/spacing (1/3oz): | 0.05mm/0.06mm | |
| Min width/spacing (1/2oz): | 0.06mm/0.07mm | |
| Min width/spacing (1oz): | Single layer: 0.07mm/0.08mm | |
| Double layer: 0.08mm/0.09mm | |
| Aspect Ratio | 6:01 | 8:01 |
| Base Copper | 1/3Oz--2Oz | 3 Oz for Prototype |
| Size Tolerance | Conductor Width:±10% | W ≤0.5mm |
| Hole Size: ±0.05mm | H ≤1.5mm |
| Hole Registration: ±0.050mm | |
| Outline Tolerance:±0.075mm | L ≤50mm |
| Surface Treatment | ENIG: 0.025um - 3um | |
| OSP: | |
| Immersion Tin: 0.04-1.5um | |
| Dielectric Strength | AC500V | |
| Solder Float | 288℃/10s | IPC Standard |
| Peeling Strength | 1.0kgf/cm | IPC-TM-650 |
| Flammability | 94V-O | UL94 |
Quotation Requirement :
1) Following specifications are needed for quotation:
a) Base material
b) Board thickness:
c) Copper thickness
d) Surface treatment:
e) color of solder mask and silkscreen:
f) Quantity
Shiping method:
1) By DHL, Fedex, UPS, TNT etc.
2) By sea if it is possible
3) By air
Surface treatment:
full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray
FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.
PCB, FPC process production capability
| Technical ltem | MassProduct | Advanced Technology |
| 2016 | 2017 | 2018 |
| Max.Layer Count | 26L | 36L | 80L |
| Through-hole plate | 2～45L | 2～60L | 2～80L |
| Max.PCBSize(in) | 24*52" | 25*62" | 25*78.75" |
| The layer number of FPC | 1～36L | 1～50L | 1～60L |
| Max.PCBSize(in) | 9.8"*196" | 9.8"*196" | 10"*196"Reel to reel |
| Layeredplatelayer | 2～12L | 2～18L | 2～26L |
| Max.PCBSize(in) | 9"*48" | 9"*52" | 9"*62" |
| Combination of hard and soft layers | 3～26L | 3～30L | 3～50L |
| Interconnect HDI | 5+X+5Interconnect HDI | 7+X+7Interconnect HDI | 8+X+8,Interconnect HDI |
| HDI PCB | 4～45L | 4～60L | 4～80L |
| Interconnect HDI | 3+20+3 | 4+X+4Interconnect HDI | 4+X+4,Interconnect HDI |
| Max.PCBSize(in) | 24"*43" | 24"*49" | 25"*52" |
| Material | FR-4 Rogers | FR-4 Rogers | FR-4 Rogers |
| Base material | Halogenfree,LowDK | Halogenfree,LowDK | Halogenfree,LowDK |
| Build-up Material | FR-4 | FR-4 | FR-4 |
| BOard,Thickness(mm) | Min.12L(mm) | 0.43 | 0.42～8.0mm | 0.38～10.0mm |
| Min.16L(mm) | 0.53 | 1.60～8.0mm | 0.45～10.0mm |
| Min.18L(mm) | 0.63 | 2.0～8.0 | 0.51～10.0mm |
| Min.52L(mm) | 0.8 | 2.50～8.0mm | 0.65～10.0mm |
| MAX(mm) | 3.5 | 10.0mm | 10.0mm |
| Min.CoreThickness um(mil) | 254"(10.0) | 254"(10.0) | 0.10～254(10.0mm) |
| Min.Build up Dielectric | 38(1.5) | 32(1.3) | 25(1.0) |
| BaseCopperWeight | Inner Layer | 4/1-8 OZ | 4/1-15 OZ | 4/1-0.30mm |
| Out Layer | 4/1-10 OZ | 4/1-15 OZ | 4/1-30 OZ |
| Gold thick | 1～40u" | 1～60u" | 1～120u" |
| Nithick | 76～127u" | 76～200u" | 1～250u" |
| Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) |
| Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) |
| Min. IVH,Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) |
| DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) |
| 125(5) | 125(5) | 125(5) |
| SKipvia | Yes | Yes | Yes |
| viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes |
| Laser Hole Filling | Yes | Yes | Yes |
| Technicalltem | Mass Product | Advanced Technolgy |
| 2017year | 2018year | 2019year |
| Drill hole depth ratio | ThroughHole | 2017year | .40:1 | .40:1 |
| Aspet Ratio | Micro Via | .35:1 | 1.2:1 | 1.2:1 |
| Copper Filling Dimple Size um(Mil) | 10(0.4) | 10(0.4) | 10(0.4) |
| Min.LineWidth＆space | lnner Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) |
| Plated Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) |
| BGAPitch mm(Mil) | 0.3 | 0.3 | 0.3 |
| Min.PTH Hole ring um(mil) | 75(3mil) | 62.5(2.5mil) | 62.5(2.5mil) |
| Line Width Control | ∠2.5MIL | ±0.50 | ±0.50 | ±0.50 |
| 2.5Mil≤L/W∠4mil | ±0.50 | ±0.50 | ±0.50 |
| ≦3mil | ±0.60 | ±0.60 | ±0.60 |
| Laminated structure | Layer by layer | 3+N+3 | 4+N+4 | 5+N+5 |
| Sequential Build-up | 20L Any Layer | 36L Any Layer | 52L Any Layer |
| Multi-layer overlay | N+N | N+N | N+N |
| N+X+N | N+X+N | N+X+N |
| sequential Lamination | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 |
| Soft and hard bonding | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 |
| PTH filling process | PTH resin plug hole + plating fill
Electroplated hole/copper plug hole | PTH resin plug hole + plating fill
Electroplated hole/copper plug hole | PTH resin plug hole + plating fill
Electroplated hole/copper plug hole |
